Search Results - "Chen, Simon"

Comprehensive Relighting: Generalizable and Consistent Monocular Human Relighting and Harmonization

Wang, Junying, Liu, Jingyuan, Sun, Xin, Singh, Krishna Kumar, Shu, Zhixin, Zhang, He, Yang, Jimei, Zhao, Nanxuan, Wang, Tuanfeng Y., Chen, Simon S., Neumann, Ulrich, Yoon, Jae Shin

Drone-Based Antenna Beam Calibration in the High Arctic

Herman, Lawrence, Barbarie, Christopher, Agrawal, Mohan, Calinescu, Vlad, Chen, Simon, Chiang, H. Cynthia, Day, Cherie K., Egan, Eamon, Fay, Stephen, Gerodias, Kit, Goss, Maya, Hétu, Michael, Jacobs, Daniel C., Lalonde, Marc-Olivier R., McGee, Francis, Miara, Loïc, Orlowski-Scherer, John, Sievers, Jonathan

DPRoute: Deep Learning Framework for Package Routing

Yeh, Yeu-Haw, Chen, Simon Yi-Hung, Chen, Hung-Ming, Tu, Deng-Yao, Fang, Guan-Qi, Kuo, Yun-Chih, Chen, Po-Yang

2023 28th Asia and South Pacific Design Automation Conference (ASP-DAC)

PRN: Panoptic Refinement Network

Sun, Bo, Kuen, Jason, Lin, Zhe, Mordohai, Philippos, Chen, Simon

2023 IEEE/CVF Winter Conference on Applications of Computer Vision (WACV)

Layered Depth Refinement with Mask Guidance

Kim, Soo Ye, Zhang, Jianming, Niklaus, Simon, Fan, Yifei, Chen, Simon, Lin, Zhe, Kim, Munchurl

2022 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR)

System-level verification of a packaged silicon photonics-based transceiver

Dong, Po, Chen, Simon, Li, Changyi, Zheng, Kejia, Zhang, Li, Si, Wei, Zeng, Shanshan, Sun, Yao, Ran, Shihuan, Zhou, Linjie

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

Substrate Signal Routing Solution Exploration for High-Density Packages with Machine Learning

Yeh, Yeu-Haw, Chen, Simon Yi-Hung, Chen, Hung-Ming, Tu, Deng-Yao, Fang, Guan-Qi, Kuo, Yun-Chih, Chen, Po-Yang

2022 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)

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Practical Substrate Design Considering Symmetrical and Shielding Routes

Chi, Hao-Yu, Chen, Simon Yi-Hung, Chen, Hung-Ming, Liu, Chien-Nan, Kuo, Yun-Chih, Chang, Ya-Hsin, Ho, Kuan-Hsien

2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)

SSH: A Self-Supervised Framework for Image Harmonization

Jiang, Yifan, Zhang, He, Zhang, Jianming, Wang, Yilin, Lin, Zhe, Sunkavalli, Kalyan, Chen, Simon, Amirghodsi, Sohrab, Kong, Sarah, Wang, Zhangyang

2021 IEEE/CVF International Conference on Computer Vision (ICCV)

Learning to Recover 3D Scene Shape from a Single Image

Yin, Wei, Zhang, Jianming, Wang, Oliver, Niklaus, Simon, Mai, Long, Chen, Simon, Shen, Chunhua

2021 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR)

Brief Report: High Levels of CD47 Expression in Thymic Epithelial Tumors

Sun, Thomas Yang, Nguyen, Brandon, Chen, Simon B, Natkunam, Yasodha, Padda, Sukhmani, van de Rijn, Matt, West, Robert, Neal, Joel W, Wakelee, Heather, Riess, Jonathan W

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Towards Accurate Reconstruction of 3D Scene Shape from A Single Monocular Image

Yin, Wei, Zhang, Jianming, Wang, Oliver, Niklaus, Simon, Chen, Simon, Liu, Yifan, Shen, Chunhua

Improved Hardy-Sobolev Inequality under Moment Constraints.

Chen, Simon¹ simon.chen2@mail.mcgill.ca

EMI Shielding Technology in 5G RF System in Package Module

Li, Jay, Tsai, Mike, Chiu, Ryan, He, Eric, Hsieh, Alex, Tsai, Ming-fan, Chu, Frank, Chen, J. Y., Jian, Shunyu, Chen, Simon, Wang, Yu-Po

2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Irregular Bumps Design Planning for Modern Ball Grid Array Packages

Chang, Hsin-Yu, Chen, Hung-Ming, Kuo, Yun-Chih, Tsai, Hsien-Ting, Chen, Simon Yi-Hung, Jiang, Jyun-Ru, Chien, Ya-Ying, Chen, Yu-Yang

2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

On Pre-Assignment Route Prototyping for Irregular Bumps on BGA Packages

Jiang, Jyun-Ru, Kuo, Yun-Chih, Chen, Simon Yi-Hung, Chen, Hung-Ming

2020 Design, Automation & Test in Europe Conference & Exhibition (DATE)

Innovative EMI Shielding Solutions on Advanced SiP Module for 5G Application

Tsai, Mike, Chiu, Ryan, He, Eric, Chen, J. Y., Chu, Frank, Tsai, Jensen, Wang, Yu-Po, Jian, Shunyu, Chen, Simon

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

Advanced Antenna Integration of 3D System in Package Solutions for IoT and 5G Application

Tsai, Mike, Chiu, Ryan, He, Eric, Chen, J. Y., Chu, Frank, Tsai, Jensen, Wang, Yu-Po, Jian, Shunyu, Chen, Simon

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

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