Sökresultat - "Cheng-Fu Chen"

SCC Susceptibility of Polystyrene/TiO2 Nanocomposite-Coated Thin-Sheet Aluminum Alloy 2024—T3 in 3.5% NaCl

Cheng-fu Chen, Brian Baart, John Halford, Junqing Zhang

electronic resource

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Polystyrene Coating on APTES-Primed Hydroxylated AA2024-T3: Characterization and Failure Mechanism of Corrosion

Cheng-fu Chen

electronic resource

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The Role of APTES as a Primer for Polystyrene Coated AA2024-T3

John Halford, Cheng-fu Chen

electronic resource

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Temporal Sequencing and Narration in Learner Language: The Case of an Intensive Mandarin Chinese Program

Cheng-Fu Chen

electronic resource

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SenCu as a Sensing System to Experience Programming Design

Chen, Ssu-Ying, Hsieh, Yi-Jie, Lo, Hsiao-Ju, Cheng, Fu-Chen, Yang, Chih-Chyau, Wu, Chien-Ming, Huang, Chun-Ming

2022 IEEE International Conference on Teaching, Assessment and Learning for Engineering (TALE)

A rugged sensor system for real-time bridge safety monitoring in Taiwan

Yang, Chih-Chyau, Chen, Ssu-Ying, Hsieh, Yi-Jie, Cheng, Fu-Chen, Huang, Yu-Cheng, Chue, Jin-Ju, Kuo, Chih-Ting, Wu, Chien-Ming, Huang, Chun-Ming

2016 IEEE Sensors Applications Symposium (SAS)

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Parameter study to the interposer stress analysis of fine pitch 3-D stack package

Chen, Ching-I, Cheng, Fu-Chen, Zhan, Chau-Jie, Chang, Tao-Chih

2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Modeling and Simulations of the Underfill Filler Settling Effect on the Interfacial Stresses of Flip Chip Packaging

Cheng-fu Chen, Thammadi, N.

2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface

Energy efficient routing for clustered wireless sensors network

Cheng-fu Chen

IECON'03. 29th Annual Conference of the IEEE Industrial Electronics Society

Characterization of drop impact survivability of a 3D CSP stack module

Peterson, Daniel, Cheng-fu Chen, Karulkar, Pramod C.

2008 58th Electronic Components and Technology Conference (ECTC 2008)

Influence of filler settling on the analysis of solder reliability of flip chip packaging

Cheng-fu Chen, Karulkar, Pramod C.

2008 58th Electronic Components and Technology Conference (ECTC 2008)

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