Search Results - "Fu, Zhiwei"

Leveraging Human Knowledge in Large Language Model for Obfuscation-Resisted Phishing URL Detection

Fu, Zhiwei, Acharya, Sudipta, Ding, Steven H. H., Zhu, Yifan, Fu, Jia, Xu, Chen

2024 Ninth International Conference On Mobile And Secure Services (MobiSecServ)

Aging Assessment of 220 kV Submarine Cables Based on Ultra-Low Frequency Dielectric Loss

Li, Wenhao, Han, Tao, Du, Boxue, Huang, Youcong, Fu, Zhiwei

2024 IEEE 5th International Conference on Dielectrics (ICD)

Initiation and Growth Characteristics of Electrical Trees at Ultra-Low Frequency Voltage

Li, Wenhao, Han, Tao, Du, Boxue, Huang, Youcong, Fu, Zhiwei

2024 IEEE 5th International Conference on Dielectrics (ICD)

Degradation Behavior and Mechanism of E-mode Cascode GaN HEMTs under Hydrogen Environment

Zhao, Pengfei, Zha, Zhiwei, Xiao, Qingzhong, Chen, Jian, Zhu, Jianyuan, Fu, Zhiwei, Chen, Yiqiang

2023 International Conference on Power Energy Systems and Applications (ICoPESA)

Magnetically Oriented 3D-Boron Nitride Nanobars Enable Efficient Heat Dissipation for 3D-Integrated Power Packaging

Wang, Jian^{aff1, aff2, aff3}, Yang, Chao^{aff1, aff2, aff3}, Ma, Dezhi^{aff1, aff2, aff3}, Zhang, Mowen^{aff1, aff2}, Li, Xing^{aff1, aff2}, Li, Zhiqiang^aff3, He, Zhiyuan^aff2, Liu, Linhua^{aff1, aff3}, Fu, Zhiwei^{aff1, aff2}, Yang, Jia-Yue^{aff1, aff3}

A Brief Review and Comparison Between Transmitarray Antennas, Reflectarray Antennas and Reconfigurable Intelligent Surfaces

Fu, Zhiwei, Zou, Xiaopeng, Liao, Yunqi, Lai, Guoming, Li, Yuzhong, Chung, Kwok L.

2022 IEEE Conference on Telecommunications, Optics and Computer Science (TOCS)

Electrochemical Behavior and Corrosion Mechanism of Copper Alloys in Coastal Environment Via Al/Ni Doping Strategy

Fu, Zhiwei, Huang, Youcong^{Aff1, IDs11665023086993_cor2}, Zheng, Zhongnan, Zhang, Ying, Xu, Jun, Chen, Shaokang, Zhang, Hao

Temperature test comparison of GaN devices under different light source responses based on thermoreflectance thermography

Zha, Zhiwei, Zhu, Jianyuan, Yang, Xiaofeng, Huang, Xu, Guo, Huaixin, Xie, An, Lu, Xiangjun, Fu, Zhiwei

2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

High Speed Transient Thermal Simulation of GaN HEMT Devices

Wang, Jian, Wang, Ruoda, He, Zhiyuan, Yang, Chao, Fu, Zhiwei, Yang, Jia-Yue

2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

Evaluation of the Square Root t Method in Junction Temperature Measurement of GaN HEMTs during Power Cycling Test

Huang, Xu, Sun, Pengju, He, Zhiyuan, Fu, Zhiwei, Zhan, Xiaohua, Wang, Yan

2022 4th International Conference on Power and Energy Technology (ICPET)

Wearable, Biodegradable, and Antibacterial Multifunctional Ti3C2T x MXene/Cellulose Paper for Electromagnetic Interference Shielding and Passive and Active Dual-Thermal Management

Yang, Jiaxin^aff1, Hong, Wang^{aff1, aff2, aff3, aff4}, Zhang, Jizheng^aff5, Liu, Ming^aff5, Fu, Zhiwei^{aff1, aff2, aff3, aff4}, Zhang, Yifei^aff1, Guo, Qinglei^aff1, Li, Yan^aff5, Cai, Rong^aff6, Qian, Kai^{aff1, aff2, aff3, aff4}

Pluvio: Assembly Clone Search for Out-of-domain Architectures and Libraries through Transfer Learning and Conditional Variational Information Bottleneck

Fu, Zhiwei, Ding, Steven H. H., Alaca, Furkan, Fung, Benjamin C. M., Charland, Philippe

Synthesis of a Novel Spherical-Shell-Structure Polymerized Ionic Liquid Microsphere PILM/Au/Al(OH)3 Catalyst for Benzyl Alcohol Oxidation

Su, Ziyi^aff1, Yang, Chenghan^aff1, Deng, Qinghua^aff1, Zhou, Yuming^aff1, Mao, Chunfeng^aff1, Fu, Zhiwei^aff2, Zhu, Chenzi^aff1, Zhang, Yiwei^aff1

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Biodegradable, Flexible Transparent Ordered Ag NWs Micromesh Conductor for Electrical Heater and Electromagnetic Interference Shielding Applications

Hong, Wang^{aff1, aff2}, Sun, Bowen^aff1, Li, Zhaolin^aff1, Fu, Zhiwei^aff1, Zhang, Jiawei^aff1, Jiang, Mingshun^aff1, Zhang, Yang^aff3, Li, Yan^aff3, Zhang, Yifei^aff1, Qian, Kai^{aff1, aff2}

Predicting the Length of Stay of Patients in Hospitals

Fu, Zhiwei, Gu, Xinran, Fu, Jia, Moattari, Mojtaba, Zulkernine, Farhana

2021 IEEE International Conference on Bioinformatics and Biomedicine (BIBM)

A stretchable high-sensitive capacitive sensor for aerodynamic pressure measurement

Yang, Xiaofeng, Chen, Jian, Chen, Si, Zhou, Bin, Shi, Yijun, Fu, ZhiWei

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

Comparative Research of Infrared Thermography and Electrical Measurement Method for the Thermal Characteristics Test of GaN HEMT Devices

Fu, Zhiwei, Zheng, Bingjie, Huang, Xu, Zhou, Bin, Yang, Xiaofeng, Guo, Huaixin

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

The In-Situ Observation of microstructure, grain orientation evolution and its effect on crack propagation path in SAC305 under extreme temperature changes

Xu, KeXin, Fu, Xing, Liu, Min, Fu, ZhiWei, Chen, Si, Shi, YiJun, Huang, Yun, Chen, HongTao

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

Research on Electromigration Behavior of Cu Pillar Bumps under Pulse Current Stress

Xu, JiLe, Lu, XiangJun, Fu, ZhiWei, Qu, ChenBing, Luo, Xiao, Wang, PengFei

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)