Search Results - "Geng, Di"

Novel 4F2 Multi-Bit Dual-Gate 2T0C for High-Density DRAM with Improved Vertical-Channel IGZO TFTs by Self-Aligned Single-Step Process

Liao, Fuxi, Zhu, Zhengyong, Chen, Kaifei, Yang, Guanhua, Liu, Menggan, Lu, Wendong, Wu, Zijing, Niu, Jiebin, Lu, Congyan, Kang, Bok-Moon, Shi, Jinghong, Wu, Xie-Shuai, Yu, Runsen, Zhang, Weidong, Zhang, Jing, Wang, Gui-Lei, Yue, Jinshan, Wang, Jiawei, Wang, Lingfei, Geng, Di, Lu, Nianduan, Zhao, Chao, Nathan, Arokia, Li, Ling, Liu, Ming

2024 IEEE International Electron Devices Meeting (IEDM)

First Demonstration of 4-Layer Stacked Planar Channel-All-Around (P-CAA) IGZO FETs with Cost-Effective Process for High-Density 1T1C 3D DRAM

Ai, Xuezheng, Li, Weiwei, Gu, Chen, Chen, Chuanke, Duan, Xinlv, Lu, Congyan, Chen, Jianqi, Wang, Xiangsheng, Zhang, Kaiping, Dai, Jin, Liu, Mingxu, Niu, Jiebin, Huang, Chuanhui, Xiang, Jinjuan, Yu, Yong, Shao, Feng, Yang, Guanhua, Liu, Yu, Liu, Xiaomeng, Wang, Shaohua, Kang, Bok-Moon, Li, Gengfei, Zhao, Shenjie, Lu, Nianduan, Geng, Di, Wang, Guilei, Zhao, Chao, Li, Ling, Liu, Ming

2024 IEEE International Electron Devices Meeting (IEDM)

D2D Variation Aware DTCO for Novel Vertical a-IGZO-FETs in Large-Scale M3D 2TOC DRAM Bit Cell Evaluation via Statistical Modeling Methodology

Zhao, Yue, Yu, Yong, Guo, Jingrui, Wang, Lingfei, Yang, Nan, Jiang, Jianpeng, Lu, Yanan, Zhou, Menglong, Huang, Shijie, Xu, Lihua, Wu, Zhenhua, Yang, Guanhua, Geng, Di, Wang, Guilei, Kang, Bryan, Zhao, Chao, Li, Ling, Liu, Ming

2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

This result is not displayed to guests.
Login for full access.

This result is not displayed to guests.
Login for full access.

This result is not displayed to guests.
Login for full access.

This result is not displayed to guests.
Login for full access.

This result is not displayed to guests.
Login for full access.

Dual-band Dual-mode Chiral Metasurface for Terahertz Near-field Imaging

Ma, Aning, Geng, Di, Li, Guojian

2024 Photonics & Electromagnetics Research Symposium (PIERS)

First Demonstration of Stacked 2T0C-DRAM Bit-Cell Constructed by Two-Layers of Vertical Channel-All-Around IGZO FETs Realizing 4F2 Area Cost

Chen, Chuanke, Xiang, Jinjuan, Duan, Xinlv, Lu, Congyan, Niu, Jiebin, Zhang, Kaiping, Liu, Yu, Lu, Nianduan, Jiao, Zhengying, Shen, Yongqing, Luan, Qingjie, Wang, Guilei, Zhao, Chao, Yang, Guanhua, Geng, Di, Li, Ling, Liu, Ming

2023 International Electron Devices Meeting (IEDM)

Improved Multi-bit Statistics of Novel Dual-gate IGZO 2T0C DRAM with In-cell VTH Compensation and ΔVSN/ΔVDATA Boosting Technique

Chen, Kaifei, Zhu, Zhengyong, Lu, Wendong, Liu, Menggan, Liao, Fuxi, Wu, Zijing, Niu, Jiebin, Kang, Bok-Moon, Dan, Wang, Wu, Xie-Shuai, Liu, Ming-Xu, Yu, Yong, Yang, Nan, Wang, Gui-Lei, Cao, Kan-Yu, Wang, Lingfei, Geng, Di, Lu, Nianduan, Yang, Guanhua, Zhao, Chao, Nathan, Arokia, Li, Ling, Liu, Ming

2023 International Electron Devices Meeting (IEDM)

30 Mb/mm2/layer 3D eDRAM Computing-in-Memory with Embedded BEOL Peripherals and Local Layer-wise Calibration based on First-Demonstrated Vertically-stacked CAA-IGZO 4F2 2T0C Cell

Tang, Wenjun, Chen, Chuanke, Liu, Jialong, Zhang, Chunyu, Gu, Chen, Duan, Xinlv, Yang, Huazhong, Li, Ling, Li, Xueqing, Geng, Di

2023 International Electron Devices Meeting (IEDM)

Cell Structure and Process Integration of a Novel 2T0C Technology for High-Density Dram Application

Zhu, Zheng-Yong, Kang, Bok-Moon, Zhang, Jing, Duan, Xin-Lv, Xiang, Jin-Juan, Yang, Guan-Hua, Geng, Di, Dan, Wang, Wu, Xie-Shuai, Liu, Ming-Xu, Wang, Gui-Lei, Zhao, Chao

2023 China Semiconductor Technology International Conference (CSTIC)

Prompt-based Graph Model for Joint Liberal Event Extraction and Event Schema Induction

Li, Haochen, Geng, Di

GraphERE: Jointly Multiple Event-Event Relation Extraction via Graph-Enhanced Event Embeddings

Li, Haochen, Geng, Di

Remote Sensing Estimation of European NEP Based on Improved CASA Model and Soil Respiration Model

Qiu, Siyi, Liang, Liang, Geng, Di, Wang, Qianjie, Mu, Jinwen, Shi, Yanyan

2022 10th International Conference on Agro-geoinformatics (Agro-Geoinformatics)

A monolithic 3D IGZO-RRAM-SRAM-integrated architecture for robust and efficient compute-in-memory enabling equivalent-ideal device metrics

Yan, Shengzhe^{Aff1, Aff2}, Cong, Zhaori^{Aff1, Aff2}, Wang, Zi, Dai, Zhuoyu^{Aff1, Aff2}, Guo, Zeyu^{Aff1, Aff2}, Qian, Zhihang^{Aff1, Aff2}, Li, Xufan^{Aff1, Aff2}, Zheng, Xu^{Aff1, Aff2}, Chen, Chuanke^{Aff1, Aff2}, Lu, Nianduan, Dou, Chunmeng, Yang, Guanhua, Xu, Xiaoxin, Geng, Di, Yue, Jinshan^{Aff1, IDs1143202440781_cor1}, Wang, Lingfei^{Aff1, IDs1143202440781_cor2}, Li, Ling^{Aff1, IDs1143202440781_cor3}, Liu, Ming

Using compact model to verify IGZO RO performance for engineering application

Yong, Yu, Liang, Jing, Yang, Nan, Xiao, De-Yuan, Jiang, Jian-Peng, Guo, Jing-Rui, Wang, Ling-Fei, Geng, Di, Ba, Lan-Song, Liang, Hong-Gang, Lu, Ya-Nan, Wang, Dan, Li, Yu-Ke, Yin, Xiao-Ming, Huang, Long, Shi, Jiang-Liu, Wang, Gui-Lei, Tang, Yan-Zhe, Li, Hong-Wen, Kang, Bryan, Yoo, Abraham, Cao, Kan-Yu, Li, Ling, Zhao, Chao

2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)

This result is not displayed to guests.
Login for full access.

This result is not displayed to guests.
Login for full access.