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    The combined effect of reflow soldering time and Bi doping on the interfacial behavior and shear properties of Sn-0.7Cu-0.8Zn/Cu solders joint

    The combined effect of reflow soldering time and Bi doping on the interfacial behavior and shear properties of Sn-0.7Cu-0.8Zn/Cu solders joint

    Wenbin Tu, Shanlin Wang, Weihua Chen, Pengfei Wang, Jilin Xie, Si Chen, Min Zheng, Mingwei Wei, Yuhua Chen, Fan Wu

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