Search Results - "Yang, Cheng-Ting Michael"

Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets

Sahoo, Krutikesh, Harish, Vineeth, Liu, Jui-Han, Irwin, Randall, Yang, Cheng-Ting Michael, Sun, Henry, Iyer, Subramanian S.

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)