Search Results - "electromigration"

Effect of Ultrasound on the Reliability of Ni/Sn/Ni Micro Copper Pillar Solder Joints

Yang, H., Zhang, Q., Li, Y., Xiao, M., Zhang, J., Li, J.

Isolation and Cultivation and Staining of Paramecium

Patil, Satish V.^Aff3, Koli, Sunil H.^Aff4, Mohite, Bhavana V.^Aff5, Salunkhe, Jitendra D.^Aff3, Theng, Amol D.^Aff7, Patil, Atharv S.^Aff6

Amaresan, N.^Aff1, Chandarana, Komal A.^Aff2

Electromigration Failure Characterization Using Laser-Induced Nonuniform Heating

Patra, S., Ajdari, B., Ascazubi, R., Kumar, R.

Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation

Wang, X., Feng, S., Luo, T., Zhang, J., Zhang, Y., Cui, Z., Fan, X., Zhang, G., Fan, J.

Impact on Reliability of Microvoids and β-Sn Anisotropy in Flip-Chip Bumps

Murayama, K., Oon Lee, K., Shimamoto, H., Ono, T., Oi, K., Pei Lim, S., Yeo, Y., Sweatman, K., Martell, S.R., Tsuriya, M.

Zero Overhead Error-Tolerant Communication

Kohan, Somayeh Sadeghi, Hellebrand, Sybille, Wunderlich, Hans-Joachim

2025 IEEE 26th Latin American Test Symposium (LATS)

Comparing Electromigration in BTC SAC305 and Sn-Bi Solder Joints

Singh, Prabjit, Palmer, L., Ravenelle, C., Wassick, T., Aspandiar, R. F., Franco, B., Swaminathan, L., Fu, H., Murayama, K., Zhang, H., Lifton, A.

2025 Pan Pacific Strategic Electronics Symposium (Pan Pacific)

Impact of Skin Surface pH on Interstitial Fluid Extraction by Reverse Iontophoresis

Zhu, Wangwang, Yu, Haixia, Li, Xi, Liu, Youhao, Jin, Chenxi, Zhang, Xingguo, Zheng, Hao, Li, Dachao, Pu, Zhihua

2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)

Electromigration Failure Study of Advanced Flip-chip QFN Solder Interconnects with Various Metallization Combinations for High-power Automobile Applications

Liu, Yu-Chun, Wang, Shan-Bo, Chiu, Meng-Chun, Tsai, Min-Yan, Lin, Yung-Sheng, Wang, Chen-Chao, Hung, Chih-Pin, Liang, Chien-Lung

2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Enhanced Fault Localization strategies through versatile Sample Preparation Techniques for Electro Migration defect preservation and characterization

Abdullah, Farisal

2024 IEEE 40th International Electronics Manufacturing Technology (IEMT)

Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration

Tiwary, Nikhilendu, Grosse, Christian, Kogel, Michael, Windemuth, Thilo, Ross, Glenn, Vuorinen, Vesa, Brand, Sebastian, Paulasto-Krockel, Mervi

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of Pure Copper

Chih-Yu, Wang, Kwang-Lung, Lin

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

On-Chip Antennas for IC Reliability and Aging Monitoring

Muha, Andrew, Vutukuru, Manoj Yasaswi, Gogi, Vamshi Kiran, Jha, Rashmi

2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS)

In-Situ Observation on Liquid-Solid Electromigration Behavior of (111) nt-Cu/Sn/Cu Interconnects

Zhang, Shinan, Ren, Jing, Huang, Feifei, Huang, Mingliang

2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Electromigration-Induced Failure of Low-Temperature Sn-57Bi-1Ag Solder Interconnect Under Low Frequency Pulsed Direct Current Stressing

Wang, Shengbo, Ren, Jing, Huang, Feifei, Huang, Mingliang

2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Electromigration Behavior of Sn-3.5Ag Solder Joints with (110) and (111) Nanotwinned Cu UBMs

Zhang, Yanyan, Zhang, Shinan, Ren, Jing, Huang, Feifei, Huang, Mingliang

2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Electromigration Reliability of SnAgCu Solder Joints in WLCSP

Zhang, Jiou, Zhang, Xiu, Liu, Mengqi, Tian, Fuyou, Chen, Si, Xiao, Fei

2024 25th International Conference on Electronic Packaging Technology (ICEPT)

The Reliability of Complex Printed Circuit Board Assembly under Thermal Cycling, Random Vibration, Electromigration and Combined Loads

Chen, Shuai, Zhao, Wenzhong, Liu, Zhidan, Zhang, Fei, Zhao, Zhiping

2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Reliability Analysis and Comparison on Electromigration of SACQ and SAC305 Solder Balls

Xuan, Yang, Sheng, Yalan, Sun, Niuyi, Wang, Zhuqiu, Yang, Dan, Mei, Na

2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Probing the Scaling Effect on Electromigration and Segregation in Sn–58Bi Solder Interconnects Through Numerical Modeling

Liang, S., Zhang, X., Jiang, H., Zhong, Z.