Sökresultat - "interposer"

A 32 Gb/s 0.36 pJ/bit 3 nm Chiplet IO Using 2.5-D CoWoS Package With Real-Time and Per-Lane CDR and Bathtub Monitoring

Gu, J., Ma, J., Ahmed Chowdhury, A., Guo, J., Zhang, X., Ding, J., Wang, H., Chang, K.

Broadband Characterization of Interconnects in Die-Embedded Glass Interposer

Erdogan, S., Jia, X., Li, X., Kathaperumal, M., Agarwal, R., Swaminathan, M.

Double-Layer-Stacked Silicon Interposer for 2.5-D Packaging of 32 × 32 Micromirror Array Chip

Cai, M., Ling, B., Chen, D., Xia, Y., Wang, H., Han, Y., Wu, Y.

Occamy: A 432-Core Dual-Chiplet Dual-HBM2E 768-DP-GFLOP/s RISC-V System for 8-to-64-bit Dense and Sparse Computing in 12-nm FinFET

Scheffler, P., Benz, T., Potocnik, V., Fischer, T., Colagrande, L., Wistoff, N., Zhang, Y., Bertaccini, L., Ottavi, G., Eggimann, M., Cavalcante, M., Paulin, G., Gurkaynak, F.K., Rossi, D., Benini, L.

A Chiplet Platform for Intelligent Radar/Sonar Leveraging Domain-Specific Reusable Active Interposer

Liu, Y., Li, D., Yang, Z., Zhang, C., Zhang, Y., Li, X., Cao, M., Yin, S.

A Chiplet-Based High-Performance and Secure Hybrid Interconnection Network Design Against DoS and Sniffing Attacks

Mahmud, Md Tareq, Wang, Ke

SoutheastCon 2025

Ultra-High resolution tunable chip-integrated photonic delay line for THz Time-Domain Spectrometer

Charania, Sujay A., Plettemeier, Dirk

2025 16th German Microwave Conference (GeMiC)

Development of Double-Layer-Stacked Silicon Interposer for 32×32 Micromirror Array Packaging

Ling, Biyun, Cai, Minli, Chen, Dalong, Wang, Xiaoyue, Han, Yuwei, Wu, Yaming

2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)

Electrical and Thermal Characteristics Optimization in Interposer-Based 2.5-D Integrated Circuits

Zhi, C., Dong, G., Yang, D., Liu, D., Feng, Y., Wang, Y., Zhu, Z.

Co-Design and ML-Based Optimization of Through-Via in Silicon and Glass Interposers for Electronic Packaging Applications

Zaghari, P., Sinha, S.S., Hopkins, D.C., Ryu, J.E.

A Double Pulse Overlapping Laser Diode Driver With Minimum 100-ps Pulse for LiDAR System

Tong, Z., Huang, J., Mao, X., Martins, R.P., Lu, Y.

Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded

Lai, Y., Takahashi, A., Park, S.

Automotive Microcontroller Characterization Hardware – Challenges and Solutions

Karayi, Jithesh Pothandy, Rakesh, Vinodh J, Thachil, Prince V, Peter, Timmy Eapen, Ghanta, Vasavi

2024 IEEE 33rd Asian Test Symposium (ATS)

Survey of Network-on-Chip (NoC) for Heterogeneous Multicore Systems

Biglari, Siamak, Hosseini, Farahnaz, Upadhyay, Aadesh, Zhao, Hui

2024 IEEE 17th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC)

Research on Integration of Photonic and Electronic Chips Based on Glass Interposer (Invited)

Yan, Wanyi, Zhao, Jin, Chen, Yongjian, Lin, Zhuliang, Zhang, Dan, Yu, Daquan

TENCON 2024 - 2024 IEEE Region 10 Conference (TENCON)

Signal Integrity Analysis and Design for HBM3 on Silicon-Based 2.5D Packaging

Hung, Li-Chieh, Tsai, Cheng-Yu, Kuo, Hung-Chun, Jhong, Ming-Fong, Wang, Chen-Chao

2024 IEEE CPMT Symposium Japan (ICSJ)

Co-Design of Photonic IC, Electronic IC, and Interposer for 1.6 Tbps O/E Converter in Active Optical Package

Matsui, Naoki, Noriki, Akihiro, Kuwatsuka, Haruhiko, Nakamura, Fumi, Suda, Satoshi, Kurosu, Takayuki, Amano, Takeru, Ishikawa, Satoshi, Yoshikawa, Hiromichi, Motoji, Reona, Maeda, Dan, Sugita, Tomoya, Uemura, Hirotaka

2024 IEEE CPMT Symposium Japan (ICSJ)

3.2T Co-Package Optics (CPO) Module Based on 200G/ch Silicon-Organic-Hybrid (SOH) Mach-Zehnder Modulator (MZM)

Chen, Chin-Ta, Tsai, Kao-Feng, Chang, Fu-Chieh, Lin, Chuan-Kai, Yu, Jia-Cong

2024 IEEE CPMT Symposium Japan (ICSJ)

Mechanical Sample Preparation for Heterogeneous Integration(HI) Packaging

Xi, Chengjie, Khan, M Shafkat M, Varshney, Nitin, Khan, Aslam A, Richardson, Chris, Asadizanjani, Navid

2024 IEEE Physical Assurance and Inspection of Electronics (PAINE)

8-inch Wafer Level Through Glass Via (TGV) Interposer with 110-GHz Bandwidth Facing 128-GBaud 2.5D Co-Packaged Optics (CPO)

Ge, Chang, Wang, Xinyi, Du, Jiangbing, Lin, Xiaozhong, Lei, Ting, Du, Luping, He, Zuyuan

2024 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC)