Chen, G., Wang, G., Wang, Z., & Wang, L. (2025). Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era. Micromachines, 16(4), 431. https://doi.org/10.3390/mi16040431
Chicago-referens (17:e uppl.)Chen, Guoliang, Guiqi Wang, Zhenzhen Wang, och Lijun Wang. "Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era." Micromachines 16, no. 4 (2025): 431. https://doi.org/10.3390/mi16040431.
MLA-referens (9:e uppl.)Chen, Guoliang, et al. "Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era." Micromachines, vol. 16, no. 4, 2025, p. 431, https://doi.org/10.3390/mi16040431.
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