APA (7th ed.) Citation

Chen, G., Wang, G., Wang, Z., & Wang, L. (2025). Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era. Micromachines, 16(4), 431. https://doi.org/10.3390/mi16040431

Chicago Style (17th ed.) Citation

Chen, Guoliang, Guiqi Wang, Zhenzhen Wang, and Lijun Wang. "Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era." Micromachines 16, no. 4 (2025): 431. https://doi.org/10.3390/mi16040431.

MLA (9th ed.) Citation

Chen, Guoliang, et al. "Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era." Micromachines, vol. 16, no. 4, 2025, p. 431, https://doi.org/10.3390/mi16040431.