Yang, Y., Jia, H., Li, Z., Cao, Z., Zhang, H., Xu, P., & Li, X. (2025). Thermocouple-integrated resonant microcantilever for on-chip thermogravimetric (TG) and differential thermal analysis (DTA) dual characterization applications. Microsystems & Nanoengineering, 11(1), 1. https://doi.org/10.1038/s41378-024-00828-9
Chicago-referens (17:e uppl.)Yang, Yuhang, Hao Jia, Zechun Li, Zhi Cao, Haozhi Zhang, Pengcheng Xu, och Xinxin Li. "Thermocouple-integrated Resonant Microcantilever for On-chip Thermogravimetric (TG) and Differential Thermal Analysis (DTA) Dual Characterization Applications." Microsystems & Nanoengineering 11, no. 1 (2025): 1. https://doi.org/10.1038/s41378-024-00828-9.
MLA-referens (9:e uppl.)Yang, Yuhang, et al. "Thermocouple-integrated Resonant Microcantilever for On-chip Thermogravimetric (TG) and Differential Thermal Analysis (DTA) Dual Characterization Applications." Microsystems & Nanoengineering, vol. 11, no. 1, 2025, p. 1, https://doi.org/10.1038/s41378-024-00828-9.
