Hou, R., Zhang, K., Zhao, W., Zhang, H., Zhang, C., & Wang, Y. (2025). Microstructure and properties of electroless Ni–P/Sn2.5Ag0.7Cu0.1RE micro-joints during thermomigration. Scientific Reports, 15(1), 1. https://doi.org/10.1038/s41598-025-89492-1
Chicago-referens (17:e uppl.)Hou, Ruiqing, Keke Zhang, Wenjia Zhao, Haizhou Zhang, Chao Zhang, och Yonglei Wang. "Microstructure and Properties of Electroless Ni–P/Sn2.5Ag0.7Cu0.1RE Micro-joints During Thermomigration." Scientific Reports 15, no. 1 (2025): 1. https://doi.org/10.1038/s41598-025-89492-1.
MLA-referens (9:e uppl.)Hou, Ruiqing, et al. "Microstructure and Properties of Electroless Ni–P/Sn2.5Ag0.7Cu0.1RE Micro-joints During Thermomigration." Scientific Reports, vol. 15, no. 1, 2025, p. 1, https://doi.org/10.1038/s41598-025-89492-1.
