APA (7th ed.) Citation

Zhou, H., Zhang, Y., Cao, J., Su, C., Li, C., Chang, A., & An, B. (2023). Research Progress on Bonding Wire for Microelectronic Packaging. Micromachines, 14(2), 432. https://doi.org/10.3390/mi14020432

Chicago Style (17th ed.) Citation

Zhou, Hongliang, Yingchong Zhang, Jun Cao, Chenghao Su, Chong Li, Andong Chang, and Bin An. "Research Progress on Bonding Wire for Microelectronic Packaging." Micromachines 14, no. 2 (2023): 432. https://doi.org/10.3390/mi14020432.

MLA (9th ed.) Citation

Zhou, Hongliang, et al. "Research Progress on Bonding Wire for Microelectronic Packaging." Micromachines, vol. 14, no. 2, 2023, p. 432, https://doi.org/10.3390/mi14020432.