Abstract Nanotransfer printing (nTP) is one of the most promising nanopatterning methods given that it can be used to produce nano‐to‐micro patterns effectively with functionalities for electronic device applications. However, the nTP process is hindered by several critical obstacles, such as sub‐20 nm mold technology, reliable large‐area replication, and uniform transfer‐printing of functional materials. Here, for the first time, a dual nanopatterning process is demonstrated that creates periodic sub‐20 nm structures on the eight‐inch wafer by the transfer‐printing of patterned ultra‐thin (