Singh, P. K., Muller, M., Machani, K. V., Breuer, D., Hecker, M., Meier, K., . . . Bock, K. (2023). Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line. 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for, 1-3. https://doi.org/10.1109/IITC/MAM57687.2023.10154658
Chicago-referens (17:e uppl.)Singh, Prashant Kumar, Maik Muller, Kashi Vishwanath Machani, Dirk Breuer, Michael Hecker, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, och Karlheinz Bock. "Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line." 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for 2023: 1-3. https://doi.org/10.1109/IITC/MAM57687.2023.10154658.
MLA-referens (9:e uppl.)Singh, Prashant Kumar, et al. "Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line." 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for, 2023, pp. 1-3, https://doi.org/10.1109/IITC/MAM57687.2023.10154658.
