Liu, J., Chen, Y., Zhang, J., Wang, H., & Mei, Y. (2023). Conducted Electromagnetic Interference Modelling of an Automotive Printed Circuit Board. 2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Electromagnetic Compatibility (ISEMC), 2023 IEEE 7th International Symposium on, 1-7. https://doi.org/10.1109/ISEMC58300.2023.10370156
Chicago Style (17th ed.) CitationLiu, Jiadong, Ying Chen, Ji Zhang, Haihua Wang, and Yan Mei. "Conducted Electromagnetic Interference Modelling of an Automotive Printed Circuit Board." 2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Electromagnetic Compatibility (ISEMC), 2023 IEEE 7th International Symposium on 2023: 1-7. https://doi.org/10.1109/ISEMC58300.2023.10370156.
MLA (9th ed.) CitationLiu, Jiadong, et al. "Conducted Electromagnetic Interference Modelling of an Automotive Printed Circuit Board." 2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Electromagnetic Compatibility (ISEMC), 2023 IEEE 7th International Symposium on, 2023, pp. 1-7, https://doi.org/10.1109/ISEMC58300.2023.10370156.