Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets - Sahoo, Krutikesh; Harish, Vineeth; Liu, Jui-Han; Irwin, Randall; Yang, Cheng-Ting Michael; Sun, Henry; Iyer, Subramanian S. (2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th, ECTC, 2024)