APA (7th ed.) Citation

Zhu, K., Zhang, R., & He, Q. (2024). Hybrid Model-Based Thermal Analysis Methodology for Integrated Circuits. 2024 2nd International Symposium of Electronics Design Automation (ISEDA), Electronics Design Automation (ISEDA), 2024 2nd International Symposium of, 637-641. https://doi.org/10.1109/ISEDA62518.2024.10617791

Chicago Style (17th ed.) Citation

Zhu, Kexin, Runjie Zhang, and Qing He. "Hybrid Model-Based Thermal Analysis Methodology for Integrated Circuits." 2024 2nd International Symposium of Electronics Design Automation (ISEDA), Electronics Design Automation (ISEDA), 2024 2nd International Symposium of 2024: 637-641. https://doi.org/10.1109/ISEDA62518.2024.10617791.

MLA (9th ed.) Citation

Zhu, Kexin, et al. "Hybrid Model-Based Thermal Analysis Methodology for Integrated Circuits." 2024 2nd International Symposium of Electronics Design Automation (ISEDA), Electronics Design Automation (ISEDA), 2024 2nd International Symposium of, 2024, pp. 637-641, https://doi.org/10.1109/ISEDA62518.2024.10617791.