Yiu, J., Kao, W., Liu, C., & Hu, S. (2024). Multi-Layer High Speed Transmission Connector. 2024 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Electromagnetics: Applications and Student Innovation Competition (iWEM), 2024 IEEE International Workshop on, 1-4. https://doi.org/10.1109/iWEM59914.2024.10649251
Chicago-referens (17:e uppl.)Yiu, Jun-Wen, Wei-Tes Kao, Cheng-Ting Liu, och Sheng-Yao Hu. "Multi-Layer High Speed Transmission Connector." 2024 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Electromagnetics: Applications and Student Innovation Competition (iWEM), 2024 IEEE International Workshop on 2024: 1-4. https://doi.org/10.1109/iWEM59914.2024.10649251.
MLA-referens (9:e uppl.)Yiu, Jun-Wen, et al. "Multi-Layer High Speed Transmission Connector." 2024 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Electromagnetics: Applications and Student Innovation Competition (iWEM), 2024 IEEE International Workshop on, 2024, pp. 1-4, https://doi.org/10.1109/iWEM59914.2024.10649251.
