Xia, Y., Zhou, P., Zhou, C., Zhen, Y., & Du, X. (2024). Investigation of the Output Voltage of a Piezoresistive MEMS Pressure Sensor Using Finite Element Modelling. 2024 25th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2024 25th International Conference on, 1-5. https://doi.org/10.1109/ICEPT63120.2024.10668457
Chicago-referens (17:e uppl.)Xia, Yuqing, Peng Zhou, Chunming Zhou, Yubao Zhen, och Xiyao Du. "Investigation of the Output Voltage of a Piezoresistive MEMS Pressure Sensor Using Finite Element Modelling." 2024 25th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2024 25th International Conference on 2024: 1-5. https://doi.org/10.1109/ICEPT63120.2024.10668457.
MLA-referens (9:e uppl.)Xia, Yuqing, et al. "Investigation of the Output Voltage of a Piezoresistive MEMS Pressure Sensor Using Finite Element Modelling." 2024 25th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2024 25th International Conference on, 2024, pp. 1-5, https://doi.org/10.1109/ICEPT63120.2024.10668457.
