Wahl, M., Diez, S., Wohrmann, M., & Lopper, C. (2024). Optimizing Laser Direct Writing for Fan-Out Packaging. 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th, 1-5. https://doi.org/10.1109/ESTC60143.2024.10712104
Chicago-referens (17:e uppl.)Wahl, Matthias, Steffen Diez, Markus Wohrmann, och Christina Lopper. "Optimizing Laser Direct Writing for Fan-Out Packaging." 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th 2024: 1-5. https://doi.org/10.1109/ESTC60143.2024.10712104.
MLA-referens (9:e uppl.)Wahl, Matthias, et al. "Optimizing Laser Direct Writing for Fan-Out Packaging." 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th, 2024, pp. 1-5, https://doi.org/10.1109/ESTC60143.2024.10712104.
