Salahouelhadj, A., Vanstreels, K., De Messemaeker, J., Gerets, C., Slabbekoorn, J., El-Mekki, Z., . . . Beyne, E. (2024). Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging. 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th, 1-7. https://doi.org/10.1109/ESTC60143.2024.10712132
Chicago-referens (17:e uppl.)Salahouelhadj, A., K. Vanstreels, J. De Messemaeker, C. Gerets, J. Slabbekoorn, Z. El-Mekki, P. K. Mudigere Krishne Gowda, M. Gonzalez, och E. Beyne. "Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging." 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th 2024: 1-7. https://doi.org/10.1109/ESTC60143.2024.10712132.
MLA-referens (9:e uppl.)Salahouelhadj, A., et al. "Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging." 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th, 2024, pp. 1-7, https://doi.org/10.1109/ESTC60143.2024.10712132.
