Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias - Zhao, P.; Witters, L.; Jourdain, A.; Stucchi, M.; Jourdan, N.; Maes, J.W.; Bana, H.; Zhu, C.; Chukka, R.; Sebaai, F.; Vandersmissen, K.; Heylen, N.; et al. (IEEE Transactions on Electron Devices, Electron Devices, IEEE Transactions on, IEEE Trans. Electron Devices, 2024)