Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules

Gao, Y., Yin, K., Bak, C.L., Jorgensen, A.B., Zhang, Z., Zhao, H., Munk-Nielsen, S., Uhrenfeldt, C., Aunsborg, T.S.

IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 40(4):5999-6009 Apr, 2025

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Bibliographic Details
Title	Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules
Authors	Gao, Y., Yin, K., Bak, C.L., Jorgensen, A.B., Zhang, Z., Zhao, H., Munk-Nielsen, S., Uhrenfeldt, C., Aunsborg, T.S.
Source	IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 40(4):5999-6009 Apr, 2025

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