Predictive Modeling and Optimization of Wafer Warpage in FOPoP Packaging Using Element Birth and Death Technique

Wu, M., Wu, J.

IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(3):454-462 Mar, 2025

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Bibliographic Details
Title	Predictive Modeling and Optimization of Wafer Warpage in FOPoP Packaging Using Element Birth and Death Technique
Authors	Wu, M., Wu, J.
Source	IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(3):454-462 Mar, 2025

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