Sakuma, K., Yu, R., Polomoff, N., Kumar, A., Raghavan, S., Belyansky, M., . . . Jagannathan, H. (2024). D2W and W2W Hybrid Bonding System with Below 2.5 Micron Pitch for 3D Chiplet AI Applications. 2024 IEEE International Electron Devices Meeting (IEDM), Electron Devices Meeting (IEDM), 2024 IEEE International, 1-4. https://doi.org/10.1109/IEDM50854.2024.10873522
Chicago-referens (17:e uppl.)Sakuma, Katsuyuki, et al. "D2W and W2W Hybrid Bonding System with Below 2.5 Micron Pitch for 3D Chiplet AI Applications." 2024 IEEE International Electron Devices Meeting (IEDM), Electron Devices Meeting (IEDM), 2024 IEEE International 2024: 1-4. https://doi.org/10.1109/IEDM50854.2024.10873522.
MLA-referens (9:e uppl.)Sakuma, Katsuyuki, et al. "D2W and W2W Hybrid Bonding System with Below 2.5 Micron Pitch for 3D Chiplet AI Applications." 2024 IEEE International Electron Devices Meeting (IEDM), Electron Devices Meeting (IEDM), 2024 IEEE International, 2024, pp. 1-4, https://doi.org/10.1109/IEDM50854.2024.10873522.
