Full-Wave Electromagnetic Simulation Approach for Integrated 3D-IC Design - Jaiswal, Anushruti; Patil, Tejkiran; Dhanekula, Mahesh Babu; Kumar, Rahul (2024 IEEE 26th Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th, 2024)