Electromigration Simulation of Copper-Pillar Bump in 3D Integration

Du, Zhoubang, Du, Leiming, Zhang, GuoQi

2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025 26th International Conference on. :1-7 Apr, 2025