Chen, C., & Thammadi, N. (2006). Modeling and Simulations of the Underfill Filler Settling Effect on the Interfacial Stresses of Flip Chip Packaging. 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on, 51-56. https://doi.org/10.1109/ISAPM.2006.1665995
Chicago-referens (17:e uppl.)Chen, Cheng-fu, och N. Thammadi. "Modeling and Simulations of the Underfill Filler Settling Effect on the Interfacial Stresses of Flip Chip Packaging." 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on 2006: 51-56. https://doi.org/10.1109/ISAPM.2006.1665995.
MLA-referens (9:e uppl.)Chen, Cheng-fu, och N. Thammadi. "Modeling and Simulations of the Underfill Filler Settling Effect on the Interfacial Stresses of Flip Chip Packaging." 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on, 2006, pp. 51-56, https://doi.org/10.1109/ISAPM.2006.1665995.
