APA (7th ed.) Citation

Hua, S., Wang, Q., Yan, H., Wang, D., & Hou, C. (2010). A high speed low power interface for inter-die communication. 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on, 1916-1918. https://doi.org/10.1109/ICSICT.2010.5667780

Chicago Style (17th ed.) Citation

Hua, Siliang, Qi Wang, Hao Yan, Donghui Wang, and Chaohuan Hou. "A High Speed Low Power Interface for Inter-die Communication." 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on 2010: 1916-1918. https://doi.org/10.1109/ICSICT.2010.5667780.

MLA (9th ed.) Citation

Hua, Siliang, et al. "A High Speed Low Power Interface for Inter-die Communication." 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on, 2010, pp. 1916-1918, https://doi.org/10.1109/ICSICT.2010.5667780.