Parameter study to the interposer stress analysis of fine pitch 3-D stack package - Chen, Ching-I; Cheng, Fu-Chen; Zhan, Chau-Jie; Chang, Tao-Chih (2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International, 2010)