Substrateless sensor packaging using wafer level fan-out technology

Briindel, M., Scholz, U., Haag, F., Graf, E., Braun, T., Becker, K.-F.

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :441-444 Dec, 2012

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Bibliographic Details
Title	Substrateless sensor packaging using wafer level fan-out technology
Authors	Briindel, M., Scholz, U., Haag, F., Graf, E., Braun, T., Becker, K.-F.
Source	2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :441-444 Dec, 2012

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