Pan, Y., Zhu, F., Fan, J., Lin, X., Tao, J., & Liu, S. (2017). Thermal-mechanical analysis of high power LED packaging during power cycling test. 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2017 18th International Conference on, 1-5. https://doi.org/10.1109/ICEPT.2017.8046394
Chicago-referens (17:e uppl.)Pan, Yongjun, Fulong Zhu, Jiajie Fan, Xinxin Lin, Jiaquan Tao, och Sheng Liu. "Thermal-mechanical Analysis of High Power LED Packaging During Power Cycling Test." 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2017 18th International Conference on 2017: 1-5. https://doi.org/10.1109/ICEPT.2017.8046394.
MLA-referens (9:e uppl.)Pan, Yongjun, et al. "Thermal-mechanical Analysis of High Power LED Packaging During Power Cycling Test." 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2017 18th International Conference on, 2017, pp. 1-5, https://doi.org/10.1109/ICEPT.2017.8046394.
