Ouyang, E., Jeong, Y., Kim, J., Lin, S., Vang, J., & Yang, A. (2020). Warpage and Void Simulation of System in Package. 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th, 2066-2071. https://doi.org/10.1109/ECTC32862.2020.00320
Chicago-referens (17:e uppl.)Ouyang, Eric, Yonghyuk Jeong, JaeMyong Kim, Susan Lin, Jay Vang, och Anthony Yang. "Warpage and Void Simulation of System in Package." 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th 2020: 2066-2071. https://doi.org/10.1109/ECTC32862.2020.00320.
MLA-referens (9:e uppl.)Ouyang, Eric, et al. "Warpage and Void Simulation of System in Package." 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th, 2020, pp. 2066-2071, https://doi.org/10.1109/ECTC32862.2020.00320.
