El-Atab, N., Suwaidan, R., Alghamdi, Y., Alhazzany, A., Almansour, R., Shaikh, S. F., . . . Hussain, M. M. (2020). Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications. 2020 IEEE 6th World Forum on Internet of Things (WF-IoT), Internet of Things (WF-IoT), 2020 IEEE 6th World Forum on, 1-6. https://doi.org/10.1109/WF-IoT48130.2020.9221305
Chicago-referens (17:e uppl.)El-Atab, Nazek, Reema Suwaidan, Yara Alghamdi, Alhanouf Alhazzany, Reema Almansour, Sohail F. Shaikh, Sherjeel Khan, och Muhammad Mustafa Hussain. "Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications." 2020 IEEE 6th World Forum on Internet of Things (WF-IoT), Internet of Things (WF-IoT), 2020 IEEE 6th World Forum on 2020: 1-6. https://doi.org/10.1109/WF-IoT48130.2020.9221305.
MLA-referens (9:e uppl.)El-Atab, Nazek, et al. "Multi-Dimensional Integration and Packaging of Devices for Internet-of-Things Applications." 2020 IEEE 6th World Forum on Internet of Things (WF-IoT), Internet of Things (WF-IoT), 2020 IEEE 6th World Forum on, 2020, pp. 1-6, https://doi.org/10.1109/WF-IoT48130.2020.9221305.
