APA (7th ed.) Citation

Kida, Y., Sankawa, R., Takahashi, K., Yamamoto, S., Watanabe, T., Mura, K., . . . Imai, T. (2020). Improved Method for Evaluation of Dielectric Breakdown Strength of Epoxy / Silica Nanocomposite Thin Films. 2020 International Symposium on Electrical Insulating Materials (ISEIM), Electrical Insulating Materials (ISEIM), 2020 International Symposium on, 297-300.

Chicago Style (17th ed.) Citation

Kida, Yusuke, Rina Sankawa, Kohei Takahashi, Shuhei Yamamoto, Takanobu Watanabe, Kotaro Mura, Yoshihiro Ohgashi, Tetsuo Yoshimitsu, and Takahiro Imai. "Improved Method for Evaluation of Dielectric Breakdown Strength of Epoxy / Silica Nanocomposite Thin Films." 2020 International Symposium on Electrical Insulating Materials (ISEIM), Electrical Insulating Materials (ISEIM), 2020 International Symposium on 2020: 297-300.

MLA (9th ed.) Citation

Kida, Yusuke, et al. "Improved Method for Evaluation of Dielectric Breakdown Strength of Epoxy / Silica Nanocomposite Thin Films." 2020 International Symposium on Electrical Insulating Materials (ISEIM), Electrical Insulating Materials (ISEIM), 2020 International Symposium on, 2020, pp. 297-300.