APA (7th ed.) Citation

Liu, Z., Chen, H., & Hou, T. (2020). Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires. 2020 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Circuits and Systems (APCCAS), 2020 IEEE Asia Pacific Conference on, 62-65. https://doi.org/10.1109/APCCAS50809.2020.9301690

Chicago Style (17th ed.) Citation

Liu, Zaiyong, Hai-Bao Chen, and Tianshu Hou. "Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires." 2020 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Circuits and Systems (APCCAS), 2020 IEEE Asia Pacific Conference on 2020: 62-65. https://doi.org/10.1109/APCCAS50809.2020.9301690.

MLA (9th ed.) Citation

Liu, Zaiyong, et al. "Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires." 2020 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Circuits and Systems (APCCAS), 2020 IEEE Asia Pacific Conference on, 2020, pp. 62-65, https://doi.org/10.1109/APCCAS50809.2020.9301690.