Feng, C., Lin, X., Xu, Y., & Zhu, F. (2020). Investigation on Contact Resistance of Connector Based on FEM. 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd, 403-405. https://doi.org/10.1109/EPTC50525.2020.9314867
Chicago-referens (17:e uppl.)Feng, Chenzefang, Xinxin Lin, Yixin Xu, och Fulong Zhu. "Investigation on Contact Resistance of Connector Based on FEM." 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd 2020: 403-405. https://doi.org/10.1109/EPTC50525.2020.9314867.
MLA-referens (9:e uppl.)Feng, Chenzefang, et al. "Investigation on Contact Resistance of Connector Based on FEM." 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd, 2020, pp. 403-405, https://doi.org/10.1109/EPTC50525.2020.9314867.
