Feng, C., Lin, X., Xu, Y., & Zhu, F. (2020). Investigation on Contact Resistance of Connector Based on FEM. 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd, 403-405. https://doi.org/10.1109/EPTC50525.2020.9314867
Chicago Style (17th ed.) CitationFeng, Chenzefang, Xinxin Lin, Yixin Xu, and Fulong Zhu. "Investigation on Contact Resistance of Connector Based on FEM." 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd 2020: 403-405. https://doi.org/10.1109/EPTC50525.2020.9314867.
MLA (9th ed.) CitationFeng, Chenzefang, et al. "Investigation on Contact Resistance of Connector Based on FEM." 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd, 2020, pp. 403-405, https://doi.org/10.1109/EPTC50525.2020.9314867.