Research on Electromigration Behavior of Cu Pillar Bumps under Pulse Current Stress - Xu, JiLe; Lu, XiangJun; Fu, ZhiWei; Qu, ChenBing; Luo, Xiao; Wang, PengFei (2021 22nd International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on, 2021)