APA (7th ed.) Citation

Yeh, Y., Chen, S. Y., Chen, H., Tu, D., Fang, G., Kuo, Y., & Chen, P. (2022). Substrate Signal Routing Solution Exploration for High-Density Packages with Machine Learning. 2022 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), VLSI Design, Automation and Test (VLSI-DAT), 2022 International Symposium on, 1-4. https://doi.org/10.1109/VLSI-DAT54769.2022.9768081

Chicago Style (17th ed.) Citation

Yeh, Yeu-Haw, Simon Yi-Hung Chen, Hung-Ming Chen, Deng-Yao Tu, Guan-Qi Fang, Yun-Chih Kuo, and Po-Yang Chen. "Substrate Signal Routing Solution Exploration for High-Density Packages with Machine Learning." 2022 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), VLSI Design, Automation and Test (VLSI-DAT), 2022 International Symposium on 2022: 1-4. https://doi.org/10.1109/VLSI-DAT54769.2022.9768081.

MLA (9th ed.) Citation

Yeh, Yeu-Haw, et al. "Substrate Signal Routing Solution Exploration for High-Density Packages with Machine Learning." 2022 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), VLSI Design, Automation and Test (VLSI-DAT), 2022 International Symposium on, 2022, pp. 1-4, https://doi.org/10.1109/VLSI-DAT54769.2022.9768081.