High Speed Transient Thermal Simulation of GaN HEMT Devices - Wang, Jian; Wang, Ruoda; He, Zhiyuan; Yang, Chao; Fu, Zhiwei; Yang, Jia-Yue (2022 23rd International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on, 2022)