APA (7th ed.) Citation

Lee, J. G., & Subramanian, K. N. (2003). Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag-based solder joints. Journal of Electronic Materials, 32(6), 523-530. https://doi.org/10.1007/s11664-003-0137-8

Chicago Style (17th ed.) Citation

Lee, J. G., and K. N. Subramanian. "Effect of Dwell Times on Thermomechanical Fatigue Behavior of Sn-Ag-based Solder Joints." Journal of Electronic Materials 32, no. 6 (2003): 523-530. https://doi.org/10.1007/s11664-003-0137-8.

MLA (9th ed.) Citation

Lee, J. G., and K. N. Subramanian. "Effect of Dwell Times on Thermomechanical Fatigue Behavior of Sn-Ag-based Solder Joints." Journal of Electronic Materials, vol. 32, no. 6, 2003, pp. 523-530, https://doi.org/10.1007/s11664-003-0137-8.