APA (7th ed.) Citation

Tu, W., Wang, H., Wang, S., Chen, Y., Wei, M., Zhang, T., & Xie, J. (2024). Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification. Journal of Electronic Materials, 53(6), 3049-3062. https://doi.org/10.1007/s11664-024-11029-5

Chicago Style (17th ed.) Citation

Tu, Wenbin, Hanbing Wang, Shanlin Wang, Yuhua Chen, Mingwei Wei, Timing Zhang, and Jilin Xie. "Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification." Journal of Electronic Materials 53, no. 6 (2024): 3049-3062. https://doi.org/10.1007/s11664-024-11029-5.

MLA (9th ed.) Citation

Tu, Wenbin, et al. "Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification." Journal of Electronic Materials, vol. 53, no. 6, 2024, pp. 3049-3062, https://doi.org/10.1007/s11664-024-11029-5.