Zhang, W., Cui, E., Zhang, B., Wang, M., & Zhao, X. (2024). Study on the material removal mechanism and the exit breakage of ultrasonic vibration-assisted grinding for microcrystalline glass. Discover Applied Sciences, 6(3), . https://doi.org/10.1007/s42452-024-05790-9
Chicago Style (17th ed.) CitationZhang, Wenchao, Enming Cui, Baoquan Zhang, Mingwei Wang, and Xiujun Zhao. "Study on the Material Removal Mechanism and the Exit Breakage of Ultrasonic Vibration-assisted Grinding for Microcrystalline Glass." Discover Applied Sciences 6, no. 3 (2024). https://doi.org/10.1007/s42452-024-05790-9.
MLA (9th ed.) CitationZhang, Wenchao, et al. "Study on the Material Removal Mechanism and the Exit Breakage of Ultrasonic Vibration-assisted Grinding for Microcrystalline Glass." Discover Applied Sciences, vol. 6, no. 3, 2024, https://doi.org/10.1007/s42452-024-05790-9.