Wang, C., & Li, Y. (2025). Microstructural Investigation of Sn-Based Solder Reactions with FeCoNiCrMn High-Entropy Alloy at Various Temperatures. JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 77(6), 4161-4172. https://doi.org/10.1007/s11837-025-07204-6
Chicago-referens (17:e uppl.)Wang, Chao-hong, och Yue-han Li. "Microstructural Investigation of Sn-Based Solder Reactions with FeCoNiCrMn High-Entropy Alloy at Various Temperatures." JOM: The Journal of The Minerals, Metals & Materials Society (TMS) 77, no. 6 (2025): 4161-4172. https://doi.org/10.1007/s11837-025-07204-6.
MLA-referens (9:e uppl.)Wang, Chao-hong, och Yue-han Li. "Microstructural Investigation of Sn-Based Solder Reactions with FeCoNiCrMn High-Entropy Alloy at Various Temperatures." JOM: The Journal of The Minerals, Metals & Materials Society (TMS), vol. 77, no. 6, 2025, pp. 4161-4172, https://doi.org/10.1007/s11837-025-07204-6.
