APA-referens (7:e uppl.)

Wang, X., Wang, D., Tian, Y., Guo, J., Miao, J., Hu, W., . . . Bao, W. (2024). A universal optoelectronic imaging platform with wafer-scale integration of two-dimensional semiconductors. Chip, 3(4), . https://doi.org/10.1016/j.chip.2024.100107

Chicago-referens (17:e uppl.)

Wang, Xinyu, et al. "A Universal Optoelectronic Imaging Platform with Wafer-scale Integration of Two-dimensional Semiconductors." Chip 3, no. 4 (2024). https://doi.org/10.1016/j.chip.2024.100107.

MLA-referens (9:e uppl.)

Wang, Xinyu, et al. "A Universal Optoelectronic Imaging Platform with Wafer-scale Integration of Two-dimensional Semiconductors." Chip, vol. 3, no. 4, 2024, https://doi.org/10.1016/j.chip.2024.100107.