APA (7th ed.) Citation

Pengcheng, X., Zengxun, L., Liguang, Z., Zepeng, W., & Zhanlong, P. (2019). 3D Heat Conductivity Model of Mold Based on Node Temperature Inheritance. High Temperature Materials and Processes, 38(2019), 92. https://doi.org/10.1515/htmp-2018-0026

Chicago Style (17th ed.) Citation

Pengcheng, Xiao, Liu Zengxun, Zhu Liguang, Wang Zepeng, and Piao Zhanlong. "3D Heat Conductivity Model of Mold Based on Node Temperature Inheritance." High Temperature Materials and Processes 38, no. 2019 (2019): 92. https://doi.org/10.1515/htmp-2018-0026.

MLA (9th ed.) Citation

Pengcheng, Xiao, et al. "3D Heat Conductivity Model of Mold Based on Node Temperature Inheritance." High Temperature Materials and Processes, vol. 38, no. 2019, 2019, p. 92, https://doi.org/10.1515/htmp-2018-0026.