Pengcheng, X., Zengxun, L., Liguang, Z., Zepeng, W., & Zhanlong, P. (2019). 3D Heat Conductivity Model of Mold Based on Node Temperature Inheritance. High Temperature Materials and Processes, 38(2019), 92. https://doi.org/10.1515/htmp-2018-0026
Chicago-referens (17:e uppl.)Pengcheng, Xiao, Liu Zengxun, Zhu Liguang, Wang Zepeng, och Piao Zhanlong. "3D Heat Conductivity Model of Mold Based on Node Temperature Inheritance." High Temperature Materials and Processes 38, no. 2019 (2019): 92. https://doi.org/10.1515/htmp-2018-0026.
MLA-referens (9:e uppl.)Pengcheng, Xiao, et al. "3D Heat Conductivity Model of Mold Based on Node Temperature Inheritance." High Temperature Materials and Processes, vol. 38, no. 2019, 2019, p. 92, https://doi.org/10.1515/htmp-2018-0026.
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