APA (7th ed.) Citation

Weng, H., Zhang, X., Liu, X., Tang, Y., Yuan, H., Xu, Y., . . . Huang, X. (2025). Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition. Nano-Micro Letters, 17(1), 1. https://doi.org/10.1007/s40820-024-01628-6

Chicago Style (17th ed.) Citation

Weng, Haotian, Xiwu Zhang, Xuan Liu, Yunhui Tang, Hewei Yuan, Yang Xu, Kun Li, and Xiaolu Huang. "Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition." Nano-Micro Letters 17, no. 1 (2025): 1. https://doi.org/10.1007/s40820-024-01628-6.

MLA (9th ed.) Citation

Weng, Haotian, et al. "Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition." Nano-Micro Letters, vol. 17, no. 1, 2025, p. 1, https://doi.org/10.1007/s40820-024-01628-6.