Weng, H., Zhang, X., Liu, X., Tang, Y., Yuan, H., Xu, Y., . . . Huang, X. (2025). Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition. Nano-Micro Letters, 17(1), 1. https://doi.org/10.1007/s40820-024-01628-6
Chicago-referens (17:e uppl.)Weng, Haotian, Xiwu Zhang, Xuan Liu, Yunhui Tang, Hewei Yuan, Yang Xu, Kun Li, och Xiaolu Huang. "Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition." Nano-Micro Letters 17, no. 1 (2025): 1. https://doi.org/10.1007/s40820-024-01628-6.
MLA-referens (9:e uppl.)Weng, Haotian, et al. "Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition." Nano-Micro Letters, vol. 17, no. 1, 2025, p. 1, https://doi.org/10.1007/s40820-024-01628-6.
