Cu-Sn alloy, Grain refinement, Corrosion behavior, Antibacterial performance, Materials of engineering and construction. Mechanics of materials, TA401-492

The effects of P, Si and Al elements on the microstructure, corrosion properties and antibacterial properties of copper-tin alloys were studied. The addition of Si and Al elements reduced the layer fault energy of Cu-Sn-P alloy, refined grain and increased twins. Cu-Sn-P-Si and Cu-Sn-P-Al alloys were prone to grain boundary stripping corrosion and twin corrosion, which promoted the release of copper ions and improved the antibacterial properties. Cu-Sn-P-Al alloy had the best antibacterial activity. These results provide theoretical guidance for the development of new antibacterial copper alloy materials by microalloying the corrosion and ion release behavior of copper alloys.